Uteco hosted the Kodak Packaging Summit

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Colognola ai Colli, On 6 February. at Uteco’s offices in Colognola ai Colli, took place the Kodak Packaging Summit, to present and show the digital printing system resulting from the collaboration between the prepress giant and the proactive (inter)national OEM. Super testimonial was the third actor in the project: Domenico Raccioppoli from Nuova Erreplast, who told us the value of a partnership that opens up the market: new works and new application areas, and the shortcut to access the “digital hungry” multinational brand owners.

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